Tool for automatically replacing defective pogo pins

ABSTRACT

Embodiments of the invention include a tool and method for automatically replacing defective pogo pins for use in testing a semiconductor package. Aspects of the invention include a nozzle tip and a pin management valve assembly coupled to the nozzle tip. The pin management valve assembly is actuatable to couple an open pin management valve or a partially closed pin management valve to the nozzle tip. The open pin management valve includes a first diameter and the partially closed pin management valve includes a second diameter. A vacuum reservoir is coupled to the pin management valve assembly and a vacuum management valve is positioned between the pin management valve assembly and the vacuum reservoir. The vacuum management valve is actuatable between an open and closed position.

DOMESTIC AND/OR FOREIGN PRIORITY

This application is a continuation of U.S. application Ser. No.15/725,515, titled “TOOL FOR AUTOMATICALLY REPLACING DEFECTIVE POGOPINS” filed Oct. 5, 2017, the entire contents of which are incorporatedherein by reference.

BACKGROUND

The present invention generally relates to equipment for testingsemiconductor devices, and more specifically, to a tool and method forautomatically replacing defective pogo pins for use in testing asemiconductor package.

In the semiconductor industry, integrated circuits (ICs) are typicallytested in wafer form prior to being packaged. That is, a wafercomprising a multitude of ICs is tested prior to dicing the wafer intoindividual chips. During this testing, the integrated circuits areindividually tested on a wafer, and appropriate action is taken if thetesting indicates that predetermined specifications are not met. Afterdicing, the individual chips are then packaged into a multitude ofsemiconductor packages, wherein the integrated circuits are electricallycoupled to electrical contacts, such as for subsequent attachment to aprinted circuit board (PCB). Once the chips are packaged, eachsemiconductor package is again tested, and appropriate action is againtaken if predetermined electrical specifications are not met.

Conventionally, manufactured semiconductor packages are tested inautomatic test equipment (ATE). A semiconductor package is inserted intoa contactor of the ATE and electrical contacts of the semiconductorpackage contact and depress a plurality of spring-biased contactor pins,also called “pogo” pins. The pogo pins of the contactor generallyprovide a temporary electrical connection between the electricalcontacts of the semiconductor package and a test PCB or test board. Thetest board, in conjunction with the contactor, is configured toelectrically test the circuits of the circuit board prior to finalassembly of the semiconductor package on a PCB.

SUMMARY

Embodiments of the present invention are directed to a tool forautomatically replacing defective pogo pins for use in testing asemiconductor package. A non-limiting example of the tool includes anozzle tip and a pin management valve assembly coupled to the nozzletip. The pin management valve assembly is actuatable to couple an openpin management valve or a partially closed pin management valve to thenozzle tip. The open pin management valve includes a first diameter andthe partially closed pin management valve includes a second diameter. Avacuum reservoir is coupled to the pin management valve assembly and avacuum management valve is positioned between the pin management valveassembly and the vacuum reservoir. The vacuum management valve isactuatable between an open and closed position.

Embodiments of the present invention are directed to a method forremoving a pogo pin from a substrate. A non-limiting example of themethod includes providing a tool operable to manipulate pogo pins. Thetool includes a nozzle tip and a pin management valve assembly coupledto the nozzle tip. The pin management valve assembly is actuatable tocouple an open pin management valve or a partially closed pin managementvalve to the nozzle tip. The open pin management valve includes a firstdiameter and the partially closed pin management valve includes a seconddiameter. The tool also includes a vacuum reservoir coupled to the pinmanagement valve assembly and a vacuum management valve positionedbetween the pin management valve assembly and the vacuum reservoir. Thevacuum management valve is actuatable between an open and closedposition. The method includes positioning the pogo pin under the nozzletip and actuating the pin management valve assembly to couple the openpin management valve to the nozzle tip. The method includes actuatingthe vacuum management valve to the open position.

Embodiments of the present invention are directed to a method formanipulating a pogo pin. A non-limiting example of the method includesproviding a tool operable to manipulate pogo pins. The tool includes anozzle tip and a pin management valve assembly coupled to the nozzletip. The pin management valve assembly is actuatable to couple an openpin management valve or a partially closed pin management valve to thenozzle tip. The open pin management valve includes a first diameter andthe partially closed pin management valve includes a second diameter.The tool also includes a vacuum reservoir coupled to the pin managementvalve assembly and a vacuum management valve positioned between the pinmanagement valve assembly and the vacuum reservoir. The vacuummanagement valve is actuatable between an open and closed position. Themethod includes positioning the pogo pin under the nozzle tip andactuating the pin management valve assembly to couple the partiallyclosed pin management valve to the nozzle tip. The method includesactuating the vacuum management valve to the open position to pull thepogo pin into the partially closed pin management valve.

Additional technical features and benefits are realized through thetechniques of the present invention. Embodiments and aspects of theinvention are described in detail herein and are considered a part ofthe claimed subject matter. For a better understanding, refer to thedetailed description and to the drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The specifics of the exclusive rights described herein are particularlypointed out and distinctly claimed in the claims at the conclusion ofthe specification. The foregoing and other features and advantages ofthe embodiments of the invention are apparent from the followingdetailed description taken in conjunction with the accompanying drawingsin which:

FIG. 1 depicts a cross-sectional view of a tool for manipulating pogopins according to one or more embodiments of the present invention;

FIG. 2 depicts a cross-sectional view of the tool perpendicular to thecross-sectional view depicted in FIG. 1 according to one or moreembodiments of the invention;

FIG. 3 depicts a blown-up cross-sectional view of a pin management valveassembly in an open position according to one or more embodiments of theinvention;

FIG. 4 depicts a blown-up cross-sectional view of the pin managementvalve assembly in a partially closed according to one or moreembodiments of the invention;

FIG. 5 depicts a blown-up cross-sectional view of a vacuum managementvalve assembly in an open position according to one or more embodimentsof the invention;

FIG. 6 depicts a blown-up cross-sectional view of the vacuum managementvalve assembly in a closed position according to one or more embodimentsof the invention;

FIG. 7 depicts a cross-sectional view of a tool for manipulating pogopins in a substrate according to one or more embodiments of theinvention;

FIG. 8 depicts a flow diagram of a method for removing pogo pins from asubstrate according to one or more embodiments of the invention; and

FIG. 9 depicts a flow diagram of a method for manipulating pogo pinsaccording to one or more embodiments of the invention.

The diagrams depicted herein are illustrative. There can be manyvariations to the diagram or the operations described therein withoutdeparting from the spirit of the invention. For instance, the actionscan be performed in a differing order or actions can be added, deletedor modified. Also, the term “coupled” and variations thereof describeshaving a communications path between two elements and does not imply adirect connection between the elements with no interveningelements/connections between them. All of these variations areconsidered a part of the specification.

In the accompanying figures and following detailed description of thedisclosed embodiments, the various elements illustrated in the figuresare provided with two or three digit reference numbers. With minorexceptions, the leftmost digit(s) of each reference number correspond tothe figure in which its element is first illustrated.

DETAILED DESCRIPTION

The present invention is directed towards equipment and methods fortesting, validating, and monitoring semiconductor devices. Moreparticularly the present invention provides a tool and method forautomatically replacing defective pogo pins used in the testing ofsemiconductor packages. Accordingly, the present invention will now bedescribed with reference to the drawings, wherein like referencenumerals are used to refer to like elements throughout. It should beunderstood that the description of these aspects are merely illustrativeand that they should not be taken in a limiting sense. In the followingdescription, for purposes of explanation, numerous specific details areset forth in order to provide a thorough understanding of the presentinvention. It will be evident to one skilled in the art, however, thatthe present invention may be practiced without these specific details.

For the sake of brevity, conventional techniques related tosemiconductor device and integrated circuit (IC) fabrication may or maynot be described in detail herein. Moreover, the various tasks andprocess steps described herein can be incorporated into a morecomprehensive procedure or process having additional steps orfunctionality not described in detail herein. In particular, varioussteps in the manufacture of semiconductor devices andsemiconductor-based ICs are well known and so, in the interest ofbrevity, many conventional steps will only be mentioned briefly hereinor will be omitted entirely without providing the well-known processdetails.

Turning now to an overview of technologies that are more specificallyrelevant to aspects of the present invention, as previously notedherein, manufactured semiconductor packages are tested in automatic testequipment (ATE). To test a particular semiconductor package, the packageis inserted into a contactor having a plurality of spring-biased pogopins. The pins provide a temporary electrical connection betweenelectrical contacts of the semiconductor package and a test PCB or testboard. In this manner circuits in the semiconductor package can betested.

One common problem with conventional contactors is that the pogo pinsare generally considered a “wear item” of the contactor. Individual pogopins become faulty due to wear, contamination, bending, oxidation, orvarious other reasons. Faulty pogo pins, and thus faulty contactors, canresult in continuity problems between the test board and thesemiconductor package to be tested, as well as potentially lost yield ifthe test apparatus is not monitored properly. To prevent such problems,the pogo pins are typically replaced throughout the operational life ofthe contactor.

With some generality, two conventional solutions exist for replacingthese contactor pogo pins. The first option is to replace all of thepogo pins at the same time. Once new pins are inserted into thecontactor an estimated wear period is determined for the nextreplacement cycle. The wear period is calculated based on theanticipated wear cycle of the pins and includes any desired tolerance.After the wear period elapses the pins are wholesale replaced and thewear period restarts. This approach advantageously simplifies the actualreplacement process and is well-suited to automated or semi-automaticsystems. A disadvantage of this approach is the indiscriminatereplacement of many working pins, significantly increasing costs.

The second option is to monitor and replace only faulty pogo pins. Thisapproach ensures that working pins are not wasted, but typicallyrequires that nonworking pins be manually replaced. Changing individualfaulty contactor pogo pins can be challenging. Typical pogo pins have avery small diameter (e.g., equal or less than about 0.020 inches).Complicating replacement further is the fact that these small pins arepacked tightly into large arrays of pins. For example, conventional pinarrays can have as many as 8,000 pins at a pitch of about 0.5 mm.Moreover, the diameter and pitch of these pins continues to shrink evenfurther to keep up with decreasing semiconductor device criticaldimensions.

Turning now to an overview of aspects of the present invention, one ormore embodiments of the invention provide a tool and method formanipulating pogo pins for use in testing a semiconductor package. Thetool includes pin management valves and vacuum management valves thatcan be pneumatically actuated between various configurations. In thismanner, a single multifunction tool is provided that is able to remove adefective pogo pin and discard it and, with the same nozzle and withsimple valve actuation, pick up a new pogo pin of the same type, storethe pogo pin temporarily, and insert it where the pogo pin needs to beinstalled.

Turning now to a more detailed description of aspects of the presentinvention, FIG. 1 depicts a cross-sectional view of a tool 100 formanipulating a pogo pin 102 in a substrate 104 according to one or moreembodiments of the invention. In some embodiments of the presentinvention, the substrate 104 is an interposer having one or moredefective pogo pins. In some embodiments of the present invention, thesubstrate 104 is a pin bank having one or more new pogo pins. The pogopin 102 can be a conventional pogo pin having a diameter of about 0.010to 0.030 inches. In some embodiments of the present invention, the pogopin 102 has a diameter of about 0.020 inches. In some embodiments of thepresent invention, the pogo pin 102 is vertically placed in an array ofpogo pins in the substrate 104. In some embodiments of the presentinvention, the pogo pin array includes more than 1,000 pogo pins at apitch of about 0.2 to 2 mm. For example, the pogo pin array can includeabout 8,000 pins at a pitch of about 0.5 mm. In some embodiments of thepresent invention, the tool 100 includes a nozzle assembly 106, a pinmanagement valve assembly 108, a vacuum management valve assembly 110,and a vacuum reservoir 112.

The nozzle assembly 106 includes a housing, nozzle tip, and tubing of asufficiently large outer diameter to allow a single pogo pin to passthrough. In some embodiments of the present invention, the outerdiameter of the nozzle tip and tubing is about 10, 15, 20, 25, 40, 50,75, 100, 125, 150 or 200 percent larger than the diameter of the pogopins, depending on the pitch of the pogo pins in the substrate 104. Insome embodiments of the present invention, the nozzle tip and tubing hasan outer diameter of about 0.4 mm, although other sizes are within thecontemplated scope of the invention. In some embodiments of the presentinvention, the inner diameter of the nozzle tip and tubing are sizedbased on the diameter of the substrate 104 pogo pin hole and the shapeof the pogo pin 102. For example, if the substrate 104 hole diameter isclose to the pogo pin 102 diameter (i.e., within 2, 5, 10 percent), thenthe nozzle tip inner diameter should be substantially equal to thediameter of the pogo pin 102 (i.e., within 5 percent). The shape of thepogo pin 102 will also influence the entry of the pogo pin 102 into thesubstrate 104 hole. For example, if there is a bevel on the pogo pin 102then insertion into the substrate 104 hole is easier and the innerdiameter of the nozzle tip can be increased. Conversely, if the shape ofthe pogo pin 102 is square, the inner diameter of the nozzle tip needsto be substantially equal (i.e., within 5 percent) to the pogo pin 102diameter to ensure alignment with the center of the substrate 104 hole.In some embodiments of the present invention, the nozzle assembly 106also includes side pin blockers 114 which prevent the tool 100 frominadvertently manipulating pogo pins adjacent to the pogo pin 102.

The nozzle assembly 106 is coupled to the pin management valve assembly108 such that the pogo pin 102 can pass through the nozzle assembly 106and into the pin management valve assembly 108. The pin management valveassembly 108 can be actuated between an open valve position and apartially closed valve position by moving a pin cylinder 116A. In someembodiments of the present invention, the pin cylinder 116A includes anair fitting and is pneumatically actuated. FIG. 3 depicts the pinmanagement valve assembly 108 in the open valve configuration. The openpin management valve 300 has a sufficiently large diameter to allow asingle pogo pin to pass through. In some embodiments of the presentinvention, the open pin management valve 300 has a substantially equaldiameter as the nozzle assembly 106 tubing. FIG. 4 depicts the pinmanagement valve assembly 108 in the partially closed valveconfiguration. The partially closed pin management valve 302 has arestricted diameter that is not sufficiently large enough to pass asingle pogo pin through. In some embodiments of the present invention,the partially closed pin management valve 302 has a diameter that is 99,98, 95, 90, 80, 60, 50, 25 percent the diameter of the nozzle assembly106 tubing.

The pin management valve assembly 108 is coupled to the vacuummanagement valve assembly 110 such that the pogo pin 102 can passthrough the pin management valve assembly 108 and into the vacuummanagement valve assembly 110. The vacuum management valve assembly 110can be actuated between an open valve position and a closed valveposition by moving a pin cylinder 116B. In some embodiments of thepresent invention, the pin cylinder 116B includes an air fitting and ispneumatically actuated. FIG. 5 depicts the vacuum management valveassembly 110 in the open valve configuration. The vacuum managementvalve 500 has a sufficiently large diameter to allow a single pogo pinto pass through. In some embodiments of the present invention, thevacuum management valve 500 has a substantially equal diameter as thenozzle assembly 106 tubing. FIG. 6 depicts the vacuum management valveassembly 110 in the closed valve configuration. The closed valveposition prevents any pogo pins from passing through and decouples thenozzle assembly 106 tubing and pin management valve assembly 108 tubingfrom the vacuum reservoir 112.

The vacuum management valve assembly 110 is coupled to the vacuumreservoir 112 such that the pogo pin 102 can pass through the vacuummanagement valve assembly 110 and into the vacuum reservoir 112. Thevacuum reservoir 112 is located within a vacuum housing 118. The vacuumreservoir 112 is under vacuum (also known as vacuum pressure). As usedherein, vacuum pressure refers to an absolute gaseous pressure that isless than atmospheric pressure. For example, the absolute pressure canbe about 0 pounds per square inch absolute (PSIA) to about 14.7 PSIA.

The vacuum housing 118 includes a reservoir suction pipe 120, areservoir closing clip 122, a pin deflector 124, and a quick connectvacuum connector 126. The reservoir suction pipe 120 is positionedwithin the vacuum reservoir 112 such that a pogo pin passing through thereservoir suction pipe 120 will strike the pin deflector 124. The pindeflector 124 ensures that a pogo pin entering the vacuum reservoir 112will not clog the reservoir suction pipe 120. The reservoir closing clip122 can be opened when access to the vacuum reservoir 112 is required,such as during maintenance or inspection periods. The quick connectvacuum connector 126 allows for the vacuum reservoir 112 to be connectedto an external source (not depicted) for re-depressurization. In thismanner, the vacuum reservoir 112 can be put back into a vacuum stateafter prolonged periods of use. In some embodiments of the presentinvention, the vacuum reservoir 112 has a volume that is substantiallygreater (i.e., more than a factor of 5, 10, 20, 100 times larger) thanthe volume of the tool 100 tubing and nozzle tip. Consequently, the tool100 can be operated for a long time with many pogo pins before requiringre-depressurization.

FIG. 2 depicts a cross-sectional view of the tool 100 perpendicular tothe cross-sectional view depicted in FIG. 1 according to one or moreembodiments of the invention. From this view, it is readily apparentthat the vacuum reservoir 112 includes one or more deflector screws 200.The deflector screws 200 can be used to adjust or otherwise position thepin deflector 124 within the vacuum housing 118. The tool 100 alsoincludes a blow off 202 located between the pin management valveassembly 108 and the vacuum management valve assembly 110. In someembodiments of the present invention, the blow off 202 extends in adirection orthogonal to the pin cylinders 116A and 116B. In someembodiments of the present invention, the blow off 202 extends in adirection parallel to the pin cylinders 116A and 116B (not depicted).

The blow off 202 is pressurized and can be actuated using an air fitting204 to push the pogo pin 102 out of the pin management valve assembly108 and nozzle assembly 106 and into a hole in the substrate 104. Priorto actuating the blow off 202, the vacuum management valve assembly 110is actuated into the closed valve position by moving the pin cylinder116B. As discussed previously herein, the closed valve positiondecouples the nozzle assembly 106 tubing and pin management valveassembly 108 tubing from the vacuum reservoir 112. As the vacuum path isclosed, actuating the blow off 202 (i.e., pressurizing the tool 100tubing) will force the pogo pin 102 out the tip of the nozzle assembly106.

In some embodiments of the present invention, the tool 100 includes oneor more sensors 206. The sensors 206 are positioned adjacent to the pinmanagement valve assembly 108 and the vacuum management valve assembly110. In some embodiments of the present invention, the sensors 206include optical fibers coupled to fiber optic sensors. The sensors 206are positioned to detect the current configuration of the pin managementvalve assembly 108 and the vacuum management valve assembly 110. In someembodiments of the present invention, the sensors 206 located adjacentto the pin management valve assembly 108 are located in the vacuum pathand include one or more O-rings 208 to prevent vacuum leakage.

FIG. 3 depicts a blown-up cross-sectional view of the pin managementvalve assembly 108 according to one or more embodiments of theinvention. The pin management valve assembly 108 includes an open pinmanagement valve 300 and a partially closed pin management valve 302.The valves 300 and 302 are positioned within a valve sleeve 304. Asdiscussed previously herein, the open pin management valve 300 and thepartially closed pin management valve 302 are actuated using the pincylinder 116A (depicted in FIG. 1). In some embodiments of the presentinvention, the pin cylinder 116A includes an air fitting and the valves300 and 302 are pneumatically actuated. The pin management valveassembly 108 is actuated such that one of the open pin management valve300 or the partially closed pin management valve 302 is coupled to thetool 100 tubing. As depicted, the pin management valve assembly 108 isactuated into the open position. In other words, the open pin managementvalve 300 is coupled to the tool 100 tubing. In this configuration, thepogo pin 102 can pass through the pin management valve assembly 108.

In some embodiments of the present invention, the pin management valveassembly 108 includes one or more valve return springs 306. The valvereturn springs 306 can be positioned such that the springs arecompressed when the pin cylinder 116A is actuated. In this manner,shutting off the pin cylinder 116A will allow the valve return springs306 and the valves 300 and 302 to return to their relaxed state. In someembodiments of the present invention, the valve return springs 306 arepositioned such that the open pin management valve 300 is the relaxed(default) state. In some embodiments of the present invention, the valvereturn springs 306 are positioned such that the partially closed pinmanagement valve 302 is the relaxed (default) state.

FIG. 4 depicts a blown-up cross-sectional view of the pin managementvalve assembly 108 according to one or more embodiments of theinvention. As discussed previously herein, the pin management valveassembly 108 includes an open pin management valve 300 and a partiallyclosed pin management valve 302. The valves 300 and 302 are positionedwithin a valve sleeve 304 and are actuated using the pin cylinder 116A(depicted in FIG. 1). In some embodiments of the present invention, thepin cylinder 116A includes an air fitting and the valves 300 and 302 arepneumatically actuated. The pin management valve assembly 108 isactuated such that one of the open pin management valve 300 or thepartially closed pin management valve 302 is coupled to the tool 100tubing. As depicted, the pin management valve assembly 108 is actuatedinto the partially closed position. In other words, the partially closedpin management valve 302 is coupled to the tool 100 tubing. In thisconfiguration, the pin management valve assembly 108 allows for thevacuum reservoir 112 to provide vacuum pressure through the pinmanagement valve assembly 108 (i.e., the tool 100 tubing is undervacuum) without allowing the pogo pin 102 to pass through.

FIG. 5 depicts a blown-up cross-sectional view of the vacuum managementvalve assembly 110 according to one or more embodiments of theinvention. In some embodiments of the present invention, the vacuummanagement valve assembly 110 includes a vacuum management valve 500.The vacuum management valve 500 is positioned within a valve sleeve 502and is actuated between open and closed positions using the pin cylinder116B (depicted in FIG. 1). In some embodiments of the present invention,the pin cylinder 116B includes an air fitting and the vacuum managementvalve 500 is pneumatically actuated. Once actuated into the open orclosed position, the vacuum management valve assembly 110 is locked intoplace by one or more vacuum valve position holes 504. As depicted, thevacuum management valve assembly 110 is actuated into the open position.In other words, the vacuum management valve 500 is coupled to the tool100 tubing. In this configuration, the pogo pin 102 can pass through thevacuum management valve assembly 110.

In some embodiments of the present invention, the vacuum managementvalve assembly 110 includes one or more valve return springs 506. Thevalve return springs 506 can be positioned such that the springs arecompressed when the pin cylinder 116B is actuated. In this manner,shutting off the pin cylinder 116B will allow the valve return springs506 and the vacuum management valve 500 to return to their relaxedstate. In some embodiments of the present invention, the valve returnsprings 506 are positioned such that the vacuum management valve 500 isin the relaxed (default) state while in the open position. In someembodiments of the present invention, the valve return springs 506 arepositioned such that the vacuum management valve 500 is the relaxed(default) state while in the closed position.

FIG. 6 depicts a blown-up cross-sectional view of the vacuum managementvalve assembly 110 according to one or more embodiments of theinvention. As discussed previously herein, the vacuum management valveassembly 110 includes a vacuum management valve 500 positioned within avalve sleeve 502. The vacuum management valve assembly 110 is actuatedbetween open and closed positions using the pin cylinder 116B (depictedin FIG. 1). In some embodiments of the present invention, the pincylinder 116B includes an air fitting and the vacuum management valve500 is pneumatically actuated. The vacuum management valve assembly 110is actuated such that one of the open pin management valve 300 or thepartially closed pin management valve 302 is coupled to the tool 100tubing. As depicted, the vacuum management valve assembly 110 isactuated into the closed position. In other words, the vacuum managementvalve 500 is decoupled from the tool 100 tubing. In this configuration,the tool 100 tubing is not under vacuum pressure and the pogo pin 102cannot pass through.

FIG. 7 depicts a cross-sectional view of a tool 700 for manipulating thepogo pin 102 in the substrate 104 according to one or more embodimentsof the invention. The tool 700 is an alternative version of the tool 100depicted in FIG. 1. In some embodiments of the present invention, thetool 700 includes a syntron feeder 702 coupled to the tool 700 tubingusing an interface 704. The syntron feeder 702 stores, orients and feedsnew pogo pins through the interface 704 and into the tool 700 tubing.The syntron feeder 702 includes a manipulation head and an internal bankfor storing and orienting the pogo pins (not depicted). The syntronfeeder 702 can be sized to store any number of pogo pins, depending onthe application requirements. In some embodiments of the presentinvention, the syntron feeder 702 stores hundreds of pogo pins. In someembodiments of the present invention, the syntron feeder 702 is itselfcoupled to an external pogo pins bank (not depicted) and is continuouslyor periodically refilled with pogo pins. The addition of the syntronfeeder 702 to the tool 700 is particularly advantageous when greatertool capacity is required or when the pogo pins supplier is not able toprovide pogo pins vertically in a bank or interposer. While moreefficient, this configuration is more expensive, as a unique syntronsystem is required for each pogo pin type. In some embodiments of thepresent invention, the interface 704 is coupled to both the vacuumreservoir 112 and the syntron feeder 702 and can be switched between afeeding operating mode (i.e., the syntron feeder 702 is coupled to thetool 700 tubing) and a removing operating mode (i.e., the vacuumreservoir 112 is coupled to the tool 700 tubing).

FIG. 8 depicts a flow diagram of a method for removing pogo pins from asubstrate according to one or more embodiments of the invention. Themethod 800 includes providing, at block 802, a tool operable to removepogo pins from a substrate. The tool can be the same as the tool 100(depicted in FIG. 1) and the tool 700 (depicted in FIG. 7) as describedpreviously herein. The tool can include a nozzle tip and a pinmanagement valve assembly 108 coupled to the nozzle tip. As describedpreviously herein, the pin management valve assembly 108 is actuatableto couple an open pin management valve 300 or a partially closed pinmanagement valve 302 to the nozzle tip. The open pin management valve300 includes a first diameter which is sufficient to allow a pogo pin topass through. The partially closed pin management valve 302 includes asecond diameter that is not sufficient to allow a pogo pin to passthrough. The tool also includes a vacuum reservoir 112 coupled to thepin management valve assembly 108 and a vacuum management valve assembly110 located between the pin management valve assembly 108 and the vacuumreservoir 112. As discussed previously herein, the vacuum managementvalve assembly 110 includes a vacuum management valve 500 that isactuatable between an open and closed position.

At block 804, the method 800 includes positioning a pogo pin under thenozzle tip. In some embodiments of the present invention, the substrateis partitioned into x and y coordinates. In this manner, the substratecan be automatically repositioned to the x and y coordinates of a givenpogo pin.

The method 800, at block 806, includes actuating the pin managementvalve assembly 108 to couple the open pin management valve 300 to thenozzle tip. In some embodiments of the present invention, the toolincludes one or more sensors 206 positioned adjacent to the pinmanagement valve assembly 108 for automatically detecting the currentconfiguration of the pin management valve assembly 108. In someembodiments of the present invention, the sensors 206 include opticalfibers coupled to fiber optic sensors.

At block 808, the vacuum management valve 500 is actuated to the openposition. In some embodiments of the present invention, the toolincludes one or more sensors 206 positioned adjacent to the vacuummanagement valve assembly 110 for automatically detecting the currentconfiguration of the vacuum management valve 500. In some embodiments ofthe present invention, the sensors 206 include optical fibers coupled tofiber optic sensors. Once the vacuum management valve 500 is actuated tothe open position, the nozzle tip will be under vacuum pressure and thepogo pin will be pulled into the vacuum reservoir 112. In someembodiments of the present invention, a high speed sensor (not depicted)is positioned over the substrate to automatically detect the successfulremoval of the pogo pin.

FIG. 9 depicts a flow diagram of a method for manipulating pogo pinsaccording to one or more embodiments of the invention. The method 900includes providing, at block 902, a tool operable to pick up new pogopins from a container (also known as a bank) and place those new pogopins into a substrate. The tool can be the same as the tool 100(depicted in FIG. 1) and the tool 700 (depicted in FIG. 7) as describedpreviously herein. The tool can include a nozzle tip and a pinmanagement valve assembly 108 coupled to the nozzle tip. As describedpreviously herein, the pin management valve assembly 108 is actuatableto couple an open pin management valve 300 or a partially closed pinmanagement valve 302 to the nozzle tip. The open pin management valve300 includes a first diameter which is sufficient to allow a pogo pin topass through. The partially closed pin management valve 302 includes asecond diameter that is not sufficient to allow a pogo pin to passthrough. The tool also includes a vacuum reservoir 112 coupled to thepin management valve assembly 108 and a vacuum management valve assembly110 located between the pin management valve assembly 108 and the vacuumreservoir 112. As discussed previously herein, the vacuum managementvalve assembly 110 includes a vacuum management valve 500 that isactuatable between an open and closed position.

At block 904, the method 900 includes positioning a pogo pin under thenozzle tip. In some embodiments of the present invention, the pogo pinbank is partitioned into x and y coordinates. In this manner, the bankcan be automatically repositioned to the x and y coordinates of the nextpogo pin.

The method 900, at block 906, includes actuating the pin managementvalve assembly 108 to couple the partially closed pin management valve302 to the nozzle tip. In some embodiments of the present invention, thetool includes one or more sensors 206 positioned adjacent to the pinmanagement valve assembly 108 for automatically detecting the currentconfiguration of the pin management valve assembly 108. In someembodiments of the present invention, the sensors 206 include opticalfibers coupled to fiber optic sensors.

At block 908, the vacuum management valve 500 is actuated to the openposition. In some embodiments of the present invention, the toolincludes one or more sensors 206 positioned adjacent to the vacuummanagement valve assembly 110 for automatically detecting the currentconfiguration of the vacuum management valve 500. In some embodiments ofthe present invention, the sensors 206 include optical fibers coupled tofiber optic sensors. Once the vacuum management valve 500 is actuated tothe open position, the nozzle tip will be under vacuum pressure and thepogo pin will be pulled into the partially closed pin management valve302. In some embodiments of the present invention, a high speed sensor(not depicted) is positioned over the bank to automatically detect thesuccessful removal of the pogo pin.

Once the pogo pin is successful trapped in the partially closed pinmanagement valve 302, the tool can be positioned over a hole in thesubstrate. To release the pogo pin the vacuum management valve 500 isactuated into the closed position, cutting off the vacuum pressure atthe nozzle tip. After vacuum pressure is shut off, a blow-off isactuated to push the pogo pin out of the partially closed pin managementvalve 302, through the nozzle tip, and into the pogo pin hole in thesubstrate. The blow off can be the same as the blow off 202 (depicted inFIG. 2) as described previously herein. Once the new pogo pin issuccessfully inserted into the substrate a new pogo pin can be loadedand the process repeated.

Additional processes may also be included. It should be understood thatthe processes depicted in FIGS. 8 and 9 represent illustrations and thatother processes may be added or existing processes may be removed,modified, or rearranged without departing from the scope and spirit ofthe present disclosure.

Various embodiments of the present invention are described herein withreference to the related drawings. Alternative embodiments can bedevised without departing from the scope of this invention. Althoughvarious connections and positional relationships (e.g., over, below,adjacent, etc.) are set forth between elements in the followingdescription and in the drawings, persons skilled in the art willrecognize that many of the positional relationships described herein areorientation-independent when the described functionality is maintainedeven though the orientation is changed. These connections and/orpositional relationships, unless specified otherwise, can be direct orindirect, and the present invention is not intended to be limiting inthis respect. Similarly, the term “coupled” and variations thereofdescribes having a communications path between two elements and does notimply a direct connection between the elements with no interveningelements/connections between them. All of these variations areconsidered a part of the specification. Accordingly, a coupling ofentities can refer to either a direct or an indirect coupling, and apositional relationship between entities can be a direct or indirectpositional relationship. As an example of an indirect positionalrelationship, references in the present description to forming layer “A”over layer “B” include situations in which one or more intermediatelayers (e.g., layer “C”) is between layer “A” and layer “B” as long asthe relevant characteristics and functionalities of layer “A” and layer“B” are not substantially changed by the intermediate layer(s).

The following definitions and abbreviations are to be used for theinterpretation of the claims and the specification. As used herein, theterms “comprises,” “comprising,” “includes,” “including,” “has,”“having,” “contains” or “containing,” or any other variation thereof,are intended to cover a non-exclusive inclusion. For example, acomposition, a mixture, process, method, article, or apparatus thatcomprises a list of elements is not necessarily limited to only thoseelements but can include other elements not expressly listed or inherentto such composition, mixture, process, method, article, or apparatus.

Additionally, the term “exemplary” is used herein to mean “serving as anexample, instance or illustration.” Any embodiment or design describedherein as “exemplary” is not necessarily to be construed as preferred oradvantageous over other embodiments or designs. The terms “at least one”and “one or more” are understood to include any integer number greaterthan or equal to one, i.e. one, two, three, four, etc. The terms “aplurality” are understood to include any integer number greater than orequal to two, i.e. two, three, four, five, etc. The term “connection”can include an indirect “connection” and a direct “connection.”

References in the specification to “one embodiment,” “an embodiment,”“an example embodiment,” etc., indicate that the embodiment describedcan include a particular feature, structure, or characteristic, butevery embodiment may or may not include the particular feature,structure, or characteristic. Moreover, such phrases are not necessarilyreferring to the same embodiment. Further, when a particular feature,structure, or characteristic is described in connection with anembodiment, it is submitted that it is within the knowledge of oneskilled in the art to effect such feature, structure, or characteristicin connection with other embodiments whether or not explicitlydescribed.

For purposes of the description hereinafter, the terms “upper,” “lower,”“right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” andderivatives thereof shall relate to the described structures andmethods, as oriented in the drawing figures. The terms “overlying,”“atop,” “on top,” “positioned on” or “positioned atop” mean that a firstelement, such as a first structure, is present on a second element, suchas a second structure, wherein intervening elements such as an interfacestructure can be present between the first element and the secondelement. The term “direct contact” means that a first element, such as afirst structure, and a second element, such as a second structure, areconnected without any intermediary conducting, insulating orsemiconductor layers at the interface of the two elements.

The terms “about,” “substantially,” “approximately,” and variationsthereof, are intended to include the degree of error associated withmeasurement of the particular quantity based upon the equipmentavailable at the time of filing the application. For example, “about”can include a range of ±8% or 5%, or 2% of a given value.

The flowchart and block diagrams in the Figures illustrate possibleimplementations of fabrication and/or operation methods according tovarious embodiments of the present invention. Variousfunctions/operations of the method are represented in the flow diagramby blocks. In some alternative implementations, the functions noted inthe blocks can occur out of the order noted in the Figures. For example,two blocks shown in succession can, in fact, be executed substantiallyconcurrently, or the blocks can sometimes be executed in the reverseorder, depending upon the functionality involved.

The descriptions of the various embodiments of the present inventionhave been presented for purposes of illustration, but are not intendedto be exhaustive or limited to the embodiments described. Manymodifications and variations will be apparent to those of ordinary skillin the art without departing from the scope and spirit of the describedembodiments. The terminology used herein was chosen to best explain theprinciples of the embodiments, the practical application or technicalimprovement over technologies found in the marketplace, or to enableothers of ordinary skill in the art to understand the embodimentsdescribed herein.

What is claimed is:
 1. A method for removing a pin from a substrate, themethod comprising: providing a tool comprising: a nozzle tip; a pinmanagement valve assembly coupled to the nozzle tip, the pin managementvalve assembly actuatable to couple an open pin management valve or apartially closed pin management valve to the nozzle tip, the open pinmanagement valve comprising a first diameter and the partially closedpin management valve comprising a second diameter; a vacuum reservoircoupled to the pin management valve assembly; and a vacuum managementvalve between the pin management valve assembly and the vacuumreservoir, the vacuum management valve actuatable between an open andclosed position; positioning the pin under the nozzle tip; actuating thepin management valve assembly to couple the open pin management valve tothe nozzle tip; and actuating the vacuum management valve to the openposition.
 2. The method of claim 1, wherein the pin is a defective orworn pin.
 3. The method of claim 1 further comprising pulling the pininto the vacuum reservoir under vacuum pressure.
 4. The method of claim1, wherein positioning the pin comprises moving the tool over thesubstrate.
 5. The method of claim 1, wherein positioning the pincomprises moving the substrate under the tool.
 6. A method formanipulating a pin, the method comprising: providing a tool comprising:a nozzle tip; a pin management valve assembly coupled to the nozzle tip,the pin management valve assembly actuatable to couple an open pinmanagement valve or a partially closed pin management valve to thenozzle tip, the open pin management valve comprising a first diameterand the partially closed pin management valve comprising a seconddiameter; a vacuum reservoir coupled to the pin management valveassembly; and a vacuum management valve between the pin management valveassembly and the vacuum reservoir, the vacuum management valveactuatable between an open and closed position; positioning the pinunder the nozzle tip; actuating the pin management valve assembly tocouple the partially closed pin management valve to the nozzle tip; andactuating the vacuum management valve to the open position to pull thepin into the partially closed pin management valve.
 7. The method ofclaim 6 further comprising positioning the nozzle tip over a pin hole ina substrate after pulling the pin into the partially closed pinmanagement valve.
 8. The method of claim 7 further comprising actuatingthe vacuum management valve to the closed position to cut off the vacuumat the nozzle tip.
 9. The method of claim 8 further comprising actuatinga blow off to push the pin out of the partially closed pin managementvalve, through the nozzle tip, and into the pin hole in the substrate.10. The method of claim 9 further comprising positioning a second pinunder the nozzle tip.